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SciAps Spectrometer Test Function Error – Full Diagnosis and Troubleshooting Guide

Abtract

SciAps spectrometers are core equipment in the fields of industrial inspection and material analysis, and their stability is crucial for production efficiency and data accuracy. This article focuses on the fault where the device “suddenly crashes during normal use and subsequent test functions cannot be accessed,” deeply analyzes the root causes of the fault, and provides step-by-step solutions and preventive measures to help users quickly restore device functionality.

SciAps spectrometer crash error screen

1. Introduction to SciAps Spectrometer Test Function Error

1.1 Application Value of SciAps Spectrometers

SciAps spectrometers (such as the InnXray-SciAps X-50) are widely used in scenarios such as alloy composition analysis, precious metal detection, and environmental monitoring. Their core function is to rapidly identify the elemental composition of samples through spectral technology. If the test function cannot be accessed, the device will be rendered unusable.

1.2 Presentation of the Test Function Error Problem

Users have reported that the device suddenly crashes during normal use. After restarting, the main system operates normally, but all test-related functions cannot be accessed, while the touch function remains normal and there is no physical hardware damage.

1.3 Purpose of This Diagnosis Guide

This article systematically addresses the issue of “test function crashes” through four modules: phenomenon reproduction, cause analysis, solution steps, and preventive measures, helping users understand the nature of the fault and acquire self-troubleshooting capabilities.

2. Detailed Description of the Fault Phenomenon

2.1 Review of User Operation Process

User operation process: The initial state shows the Android main menu, which includes non-test applications and test-related functions. After clicking on the alloy and data export icons, a blue background with a white large X error interface is displayed. The device model is InnXray-SciAps X-50, and the serial number is 00864.

2.2 Typical Characteristics of the Fault

  • Normal main system: Non-test software can be started normally.
  • Failed test function: All test-related functions cannot be accessed, displaying a unified error interface.
  • Normal touch function: The ability to accurately click icons and the return key is retained.

3. In-depth Analysis of SciAps Spectrometer Fault Causes

3.1 Software-Level Causes (Primary Issue, ~90%)

3.1.1 Corruption of software cache/temporary data

  • Role of cache: Stores temporary files to improve startup speed.
  • Reasons for corruption: Abnormal power outages, crashes, software conflicts.
  • Impact: The software cannot read key data during startup, resulting in errors.

3.1.2 Bugs or compatibility issues in the test software version

  • Version bugs: Older versions may have code defects that lead to crashes and subsequent function failures.
  • Compatibility issues: After system updates, the test software’s API interfaces may be incompatible with the new system.

3.1.3 Corruption of the test module configuration file

  • Role of the configuration file: Stores key information such as test parameters, function permissions, and calibration data.
  • Reasons for corruption: Crashes, virus infections, misoperations.
  • Impact: The software cannot recognize the test module functions and refuses to start.

3.1.4 Loss of system permissions

  • Necessary permissions: Access to sensors, saving test results, accessing dedicated interfaces of the test module.
  • Reasons for permission loss: System updates, misoperations, software conflicts.
  • Impact: The software cannot access necessary resources, leading to startup failure.

3.2 Hardware-Level Causes (Secondary Issue, ~10%)

3.2.1 Sensor or signal processing module failure

  • Role of the sensor: Collects spectral signals from samples.
  • Reasons for failure: Abnormal power outages can damage the capacitor components of the sensor.

3.2.2 Problems with the motherboard signal transmission circuit

  • Role of the circuit: Transmits signals between the test software and hardware.
  • Reasons for failure: Device drops or vibrations can loosen the cables, or long-term use in humid environments can oxidize the connectors.
SciAps test function error troubleshooting

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4. Full-Process Repair & Solution Guide for Test Function Error

4.1 Step 1: Restart the Device

  • Operation method: Press and hold the power button and select “Restart.”
  • Principle: Clears abnormal data from temporary memory and resets the software running environment.
  • Precautions: Do not force shutdown. Wait for the system to fully load after restarting.

4.2 Step 2: Clear the Test Software Cache

  • Operation method: Go to Settings → Application Management → Find the test software → Clear cache.
  • Principle: Deletes corrupted files and forces the software to regenerate normal cache.
  • Precautions: If the “Clear cache” option is grayed out, contact the official after-sales service to obtain permissions.

4.3 Step 3: Check for Software Updates

  • Operation method: Go to Settings → About → Software Update, check for and install new versions.
  • Principle: New versions fix known bugs and optimize compatibility.
  • Precautions: Back up important data before updating and ensure a stable Wi-Fi connection.

4.4 Step 4: Restore Factory Settings

  • Operation method: Go to Settings → Backup & Reset → Restore Factory Settings.
  • Principle: Resets the system to its factory state and clears all software issues.
  • Precautions: Back up user data before restoring. After restoration, the test software needs to be reinstalled.

4.5 Step 5: Hardware Inspection Suggestions

  • Operation method: Contact the official after-sales service, provide the device serial number, and request professional inspection.
  • Inspection content: Sensor performance, motherboard circuit, power module.
  • Precautions: Do not disassemble the device yourself; otherwise, the warranty will be voided.

5. Preventive Measures to Avoid Test Function Crash in SciAps Spectrometers

5.1 Regularly Update Software

  • Check for software updates once a month to promptly fix bugs.
  • Follow the official public account to get notifications about the latest versions.

5.2 Avoid Abnormal Power Outages

  • Use the original battery and avoid using low-quality batteries.
  • Charge the device when the battery level is below 20% and do not use the device while charging.

5.3 Regularly Clear Cache

  • Clear the test software cache once a month.
  • Use the official cache cleaning tool and avoid manually deleting system files.

5.4 Back Up Important Data

  • Regularly export test results and configuration files to a USB drive or cloud storage.
  • Use the official backup tool to ensure data integrity.

5.5 Operate the Device Correctly

  • Follow the instructions and avoid using the device in humid environments or dropping it.
  • Do not install unauthorized applications to avoid software conflicts.

6. Case Analysis of User Fault Conditions

6.1 Review of User Fault

The user’s device (InnXray-SciAps X-50, serial number 00864) suddenly crashed during normal use. After restarting, the test functions could not be accessed, while other software and the touch function remained normal.

6.2 Solution Process

  • Restart: Ineffective.
  • Clear cache: Ineffective.
  • Check for updates: A new version was found, downloaded, and installed, followed by a device restart.
  • Verification: Successfully accessed the test interface, and the fault was resolved.

6.3 Result Analysis

The fault was caused by a bug in the test software version, which was fixed after updating to the new version.

7. Conclusion – How to Fix SciAps Spectrometer Test Function Errors Effectively

7.1 Core Causes of the Fault

  • Main reasons: Software-level issues (cache corruption, version bugs, loss of configuration files).
  • Secondary reasons: Hardware-level issues (sensor failure, circuit problems).

7.2 Key to Solution

  • Prioritize trying software solutions (restart → clear cache → update → restore factory settings).
  • If software methods are ineffective, promptly contact the official after-sales service.

7.3 Recommendations

  • Develop the habit of regularly updating software and backing up data.
  • If the device shows abnormalities, do not disassemble it yourself and contact the official after-sales service in a timely manner.

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Noisken Electrostatic Discharge Simulator ESS-B3011A Series Manual User Guide

Introduction

In the development and production of electronic products, Electromagnetic Compatibility (EMC) testing is a crucial step to ensure product quality and reliability. Electrostatic Discharge (ESD) immunity testing, as an important part of EMC testing, is used to evaluate the anti-interference ability of electronic products when subjected to electrostatic discharges. The Noisken Electrostatic Discharge Simulator ESS-B3011A series is a high-performance, multi-functional ESD testing device widely used for ESD testing of various electronic equipment. This guide will provide a detailed introduction to the usage of the ESS-B3011A series simulator, helping users better understand and operate the equipment.

1. Product Overview

1.1 Product Introduction

The Noisken Electrostatic Discharge Simulator ESS-B3011A series is a computer-controlled electrostatic discharge generator that complies with international standards such as IEC 61000-4-2 and ISO 10605. It can simulate electrostatic discharge phenomena generated when a human body or object comes into contact with or approaches electronic equipment. By connecting different electrostatic discharge guns, this device can achieve various testing modes, including contact discharge and air discharge, helping users comprehensively evaluate the ESD immunity of electronic products.

1.2 Key Features

  • High Compatibility: Supports multiple electrostatic discharge guns, such as GT-30R/GT-30RA, TC-815R, TC-815S, etc., meeting different testing requirements.
  • Standardized Testing: Complies with international standards like IEC 61000-4-2 and ISO 10605, ensuring the authority and comparability of test results.
  • Easy Operation: The inclined front panel design facilitates operation, with well-arranged knobs and switches for convenient setting of test conditions.
  • Multi-functional Testing: Provides one-key setting of IEC standard test levels, discharge detection functions, pre-check functions, etc., supporting multiple testing modes and trigger methods.
  • Safe and Reliable: Equipped with multiple safety protection mechanisms to ensure the safety of equipment and personnel during the testing process.

2. Safety Precautions

2.1 User Restrictions

The ESS-B3011A series simulator is only intended for use by professional technicians who have received EMC testing training.
Untrained personnel operating this device may lead to serious consequences such as electric shocks or fires.
Individuals with electronic medical devices (such as pacemakers) are not allowed to use this device or enter the testing site.

2.2 Usage Environment

Do not use the ESS-B3011A series simulator in places where smoking is prohibited or where there is a risk of explosion.
Ensure good ventilation at the testing site and avoid running the device for extended periods in high-temperature, high-humidity, or corrosive environments.

2.3 Electrical Safety

Before use, check whether the device’s power cord is intact and properly grounded.
Do not arbitrarily replace the device’s power plug or use non-standard power cords.
When connecting or disconnecting device cables, ensure that the device is turned off and the power plug is disconnected.

2.4 Operational Safety

During operation, do not touch the discharge tip of the discharge gun.
The discharge gun must not be aimed at personnel or flammable items for discharge testing.
If any abnormalities (such as smoking or strange odors) are detected during the testing process, immediately stop the test, disconnect the power plug, and contact professionals for maintenance.

3. Detailed Explanation of Product Functions and Features

3.1 Compatible Standards and Discharge Guns

The ESS-B3011A series simulator supports multiple electrostatic discharge guns, each of which complies with specific international standards.
Users can select the appropriate discharge gun according to their testing needs.

  • GT-30R/GT-30RA Discharge Guns: Comply with IEC 61000-4-2 and ISO 10605 standards and are suitable for most ESD testing scenarios.
  • TC-815R/TC-815S Discharge Guns: These are existing discharge guns from Noisken that can also be used for testing with the ESS-B3011A series simulator.

3.2 Operation Panel and Switches

  • Display Screen: Displays information such as current test conditions, test modes, and test results.
  • Knob: Used to adjust the values of test parameters. Rotating the knob changes the parameter value, and pressing the knob switches the currently edited digit.
  • Function Switches: Include the power switch, test mode selection switch, trigger method selection switch, etc. Users can select the appropriate test mode and trigger method through these switches.

3.3 Convenient Functions

  • One-key Setting of IEC Standard Test Levels: By pressing the [IEC LEVEL] key, users can quickly set the test voltage levels that comply with the IEC 61000-4-2 standard.
  • Discharge Detection Function: In air discharge mode, the device can detect actual discharge situations and notify the user. This function helps users confirm whether the discharge has occurred successfully.
  • Pre-check Function: Performs a pre-check of the internal high-voltage power supply of the device before testing to ensure normal output voltage. This function helps reduce the failure rate during the testing process.

3.4 Radiation Level Modes

  • Extra Mode (EXTRA): Reduces the radiation noise generated by the discharge gun, suitable for testing scenarios sensitive to radiation noise.
  • Normal Mode (NORMAL): The radiation noise level is similar to that of previous models, suitable for general testing scenarios.
    Users can switch between radiation level modes using the [EXTRA / NORMAL] switch on the operation panel.

4. Basic Testing Process

4.1 Device Connection

  • Connect the AC Power Cord: Insert the AC power cord provided with the device into the AC inlet interface on the rear of the device and the other end into a power socket with a protective grounding terminal.
  • Connect the Discharge Gun: Align the high-voltage input connector of the discharge gun with the high-voltage output connector on the device and insert it. Then, rotate the safety ring on the discharge gun clockwise to secure the connector.

4.2 Test Planning

Determine the test mode (contact discharge or air discharge) and test conditions (polarity, voltage, discharge interval, and number of discharges) according to testing requirements.

  • Contact Discharge Testing: Use a conical discharge tip and place the tip in contact with the test point of the Equipment Under Test (EUT) for discharge testing. It is suitable for evaluating the ESD immunity of the EUT’s housing or coupling plane.
  • Air Discharge Testing: Use a circular discharge tip, move the discharge gun a certain distance away from the EUT, and then quickly approach and make contact with the EUT for discharge testing. It is suitable for evaluating the ESD immunity of the EUT’s insulating coating or insulating housing.

4.3 Basic Settings

  • Set Polarity: Select the polarity (positive or negative) of the output voltage by pressing the [+/−] switch on the operation panel.
  • Set Voltage, Discharge Interval, and Number of Discharges: Press the corresponding switches ([VOLTAGE], [INTERVAL], [COUNT]) and rotate the knob to set the values of these parameters. The voltage setting range is from 0.20 kV to 30.0 kV, the discharge interval setting range is from 0.05 seconds to 99.9 seconds, and the number of discharges setting range is from 1 to 999 times or continuous discharge.

4.4 Execute the Test

  • Start the Test: Press the [START] switch on the operation panel to start the test. The device will output high voltage and wait for a trigger signal for discharge testing.
  • Input Trigger Signal: Select the appropriate trigger method (gun trigger or controller trigger) according to the test mode. In contact discharge mode, press the trigger switch on the discharge gun for discharge; in air discharge mode, press the [TRIG] switch on the main unit for discharge.
  • Observe Test Results: During the testing process, observe the test results and the status of the warning lights on the display screen. If any abnormalities (such as discharge failure or device alarms) are found, immediately stop the test and check the device status.

4.5 End the Test

  • Stop the Test: Press the [STOP] switch on the operation panel to stop the test. The device will turn off the high-voltage power supply output and stop the discharge testing.
  • Disconnect Device Connections: After the test is completed, first disconnect the connection between the discharge gun and the EUT, and then disconnect the AC power cord. Ensure that the device is turned off before performing these operations.

5. Advanced Functions and Settings

5.1 Automatic Identification of CR Units and Discharge Cups

The ESS-B3011A series simulator has the function of automatically identifying whether the types of CR units and discharge cups and their combinations comply with standards. When the user replaces the CR unit or discharge cup and restarts the device, the device will automatically perform identification and display the compliance standards (such as IEC 61000-4-2 Ed1.2 & Ed2.0, ISO 10605 2nd Ed., etc.). This function helps users ensure the compliance of test conditions.

5.2 Sensitivity Setting of Discharge Detection Function

In air discharge mode, the discharge detection function may fail to detect the discharge due to factors such as the impedance of the discharge channel and the charged state of the tested object. At this time, users can improve the detection success rate by adjusting the sensitivity of the discharge detection function. Press and hold the [DISCHARGE DETECT] switch for more than one second to enter the sensitivity setting mode, and then rotate the knob to select low (Lo), medium (Mid), or high (Hi) sensitivity levels.

5.3 Pre-check Function

The pre-check function is used to check whether the output voltage of the internal high-voltage power supply of the device is normal. Performing a pre-check before testing ensures that the device is in good condition and reduces the failure rate during the testing process. Place the discharge gun on an insulator and away from the device body, press the [PRE CHECK] switch to display [Chk Rdy] (check ready), and then press the [START] switch to start the pre-check. The pre-check process takes about 20 seconds. After completion, the display screen will show [Chk +OK –OK] (check successful) or error information.

6. Maintenance and Troubleshooting

6.1 Daily Maintenance

  • Clean the Device: Regularly use a dry cloth to wipe off dust and dirt on the device housing and operation panel. Avoid using chemical cleaners or solvents to prevent damage to the device’s surface coating or markings.
  • Check Power Cords and Connectors: Regularly check whether the power cords and connectors are intact and properly grounded. If any damage or looseness is found, replace or tighten them in a timely manner.
  • Storage Environment: Store the device in a dry, well-ventilated environment without corrosive gases. Avoid exposing the device to high temperatures, high humidity, or direct sunlight for extended periods.

6.2 Troubleshooting

  • ERROR 1: Discharge Gun Interlock Error
    • Cause: There is an interlock signal on the high-voltage output connector.
    • Solution: Press the [STOP] switch to clear the error and correctly connect the high-voltage connector of the discharge gun.
  • ERROR 3: Trigger Error
    • Cause: The trigger switch is stuck in the input position.
    • Solution: Press the [STOP] switch to clear the error and stop the trigger switch from remaining in the input position. Try changing the trigger selection (e.g., from gun trigger to controller trigger).
  • ERROR 6: High-voltage Power Supply Output Error
    • Cause: The output of the high-voltage power supply cannot be confirmed.
    • Solution: Press the [STOP] switch to clear the error and check whether the device is faulty. If the problem persists, contact professionals for maintenance.
  • ERROR 8: CR Unit or Discharge Cup Identification Error
    • Cause: The CR unit or discharge cup is not connected, or the GT-30R/GT-30RA discharge gun is faulty.
    • Solution: Press the [STOP] switch to clear the error and correctly connect the CR unit and discharge cup. If the problem persists, check whether the CR unit and discharge cup are faulty and contact professionals for maintenance.

7. Specifications and Parameters

7.1 Main Parameters

  • Output Polarity: Positive or negative
  • Output Voltage: 0.20 kV to 30.0 kV (maximum 30.5 kV), with step settings varying according to the voltage range (0.20 kV to 10.00 kV: 0.01 kV step; 10.0 kV to 30.0 kV: 0.1 kV step)
  • Repetition Period: 0.05 seconds to 99.9 seconds (±10%), manually settable (0.05 seconds to 9.99 seconds: 0.01 second step; 10.0 seconds to 99.9 seconds: 0.1 second step)
  • Number of Discharges: 1 to 999 times (step of 1), or continuous discharge setting (set by further reducing the lower limit [1], displayed as [Cnt])
  • Electrostatic Discharge Modes: Contact discharge mode or air discharge mode
  • Radiation Level Modes: Extra mode or normal mode
  • Trigger Modes: Gun trigger or controller trigger

7.2 Recommended Discharge Guns

  • GT-30R/GT-30RA
  • TC-815R
  • TC-815S
  • TC-815-330/2K
  • TC-815S-330/2K

7.3 Electrical Parameters

  • Charging Resistance: 10 MΩ
  • Power Supply: AC100 V to AC240 V (±10%), 50 Hz/60 Hz
  • Power Consumption: 75 VA
  • Operating Temperature Range: +15°C to +35°C
  • Operating Humidity Range: 25% RH to 75% RH (no condensation)
  • Storage Temperature Range: -10°C to +50°C
  • Storage Humidity Range: 0% RH to 85% RH (no condensation)
  • External Dimensions: (Width) 270 mm x (Height) 263 mm x (Depth) 200 mm
  • Weight: Approximately 4.6 kg

8. Warranty and Maintenance Services

8.1 Warranty Period

The Noisken Electrostatic Discharge Simulator ESS-B3011A series comes with a one-year warranty service from the date of delivery. During the warranty period, if the device fails due to non-human damage, Noise Laboratory Co., Ltd. will provide free repair or replacement services.

8.2 Maintenance Services

Noise Laboratory Co., Ltd. offers professional technical maintenance services, including fault repair, component replacement, and internal adjustments. Users can contact the nearest distributor/agent or Noise Laboratory technical support for assistance.

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CTC Analytics AG HTC PAL Autosampler User Guide

Introduction

The HTC PAL autosampler produced by CTC Analytics AG is a highly flexible and powerful device widely used in fields such as chemical analysis, pharmaceuticals, and environmental monitoring. As a key tool for automated sample handling and injection, the HTC PAL not only enhances analytical efficiency but also ensures the accuracy and repeatability of results. This guide provides users with a comprehensive and practical manual covering aspects from device overview, pre-operation preparations, daily operations, maintenance, to troubleshooting.

Chapter 1 Device Overview

1.1 Introduction to the HTC PAL Autosampler

The HTC PAL autosampler is a robotic system based on X, Y, and Z-axis movements, specifically designed for chromatographic analyses (such as HPLC and GC). It can automatically complete sample picking, injection, and cleaning processes. Its highly customizable configurations and flexible operating modes enable it to adapt to a variety of analytical requirements.

1.2 Device Components

The HTC PAL autosampler mainly consists of the following parts:

  • X, Y, and Z-axis motion system: Responsible for the precise picking and injection of samples.
  • Injection unit: Includes syringes and needles for sample aspiration and injection.
  • Liquid injection valve: Controls the path of sample entry into the chromatographic system.
  • Rapid cleaning station: Used for cleaning syringes to prevent cross-contamination.
  • Keypad terminal: The user interface for setting up and monitoring device operation.
  • Safety shield: Protects operators from potential hazards.

1.3 Technical Specifications

  • Sample capacity: Depending on the configuration, it can support various trays and microplates, with sample vial capacities ranging from a few milliliters to tens of milliliters.
  • Injection volume range: 10 to 100 µL (standard configuration), with a minimum of 0.5 µL and a maximum of 5000 µL (through optional configurations).
  • Accuracy and repeatability: <0.5% RSD (Relative Standard Deviation) for peak areas from 10 µL to 100 µL, and <1.0% RSD for volumes <10 µL.
  • Injection cycle time: Typically 20 to 60 seconds, depending on plunger speed, injection volume, and cleaning cycle.

Chapter 2 Pre-Operation Preparations

2.1 Safety Precautions

  • Electrical safety: Ensure the device is properly grounded to avoid electrical shocks. Do not use damaged power cords or sockets.
  • Operational safety: During operation, avoid placing hands or other objects near moving parts to prevent injuries.
  • Chemical safety: Understand and comply with the MSDS (Material Safety Data Sheets) for all chemicals used, and wear appropriate protective gear.
  • Device protection: Do not modify the device structure or electrical connections without authorization, as this may affect device performance and safety.

2.2 Device Unboxing and Inspection

  • Confirm that all accessories are complete and undamaged.
  • Check the device exterior for any visible damage.
  • Verify the packing list to ensure all accessories and documentation have been received.

2.3 Device Installation

2.3.1 Installation Environment Requirements

  • Temperature and humidity: The device should operate within a temperature range of 4 to 40°C and a humidity environment below 75% RH.
  • Workbench: A clean, flat, and stable workbench to ensure stable device operation.
  • Power supply and grounding: Provide a stable power supply and ensure proper grounding of the device.

2.3.2 Installation Steps

  • Place the device: Position the HTC PAL autosampler in the predetermined location, ensuring sufficient space for operation and maintenance.
  • Install the injection unit: Carefully install the injection unit according to the illustrations and steps in the manual, ensuring all connections are secure and reliable.
  • Install the keypad terminal: Mount the keypad terminal near the device for easy operator monitoring and setup.
  • Connect the power supply: Plug the device power cord into a compliant power socket and ensure proper grounding.
  • Electrical connections: Correctly connect all electrical lines, including those for the injection valve and cleaning station, according to the illustrations in the manual.

2.4 Device Initialization

  • Power on: Turn on the device power, and the keypad terminal will display the initial menu.
  • System self-check: The device will automatically perform a system self-check to verify the normal operation of all components.
  • Parameter setup: Set the basic parameters of the device according to actual needs, such as language, date, and time.
  • Object positioning: Follow the steps in the manual to position key objects of the device (such as the tray holder and injection valve) to ensure accurate identification of component positions by the device.

Chapter 3 Daily Operations

3.1 Sample Preparation

  • Sample vial selection: Choose appropriate sample vials and caps based on sample properties and analytical requirements.
  • Sample loading: Accurately load samples into the sample vials, avoiding cross-contamination.
  • Sample tray configuration: Configure suitable sample trays and microplates according to the quantity and type of samples.
  • Barcode labeling: Affix barcode labels to sample vials for automatic identification and tracking by the device.

3.2 Method Creation and Editing

Method Creation

  • Select the “Method” menu on the keypad terminal to enter the method creation interface.
  • Enter the method name and select the required syringe and cycle type (e.g., LC-Inj).
  • Set method parameters, including sample volume, injection speed, and cleaning steps.
  • Save the method for future use.

Method Editing

  • Select the method to be edited from the method list.
  • Modify method parameters, such as adjusting the injection volume or cleaning time.
  • Save the modified method.

3.3 Task Queue Management

Task Creation

  • Select the “Task Queue” menu on the keypad terminal to enter the task creation interface.
  • Select the sample tray and sample range to be analyzed.
  • Choose the analytical method and set task parameters (e.g., start time, priority).
  • Add the task to the task queue.

Task Initiation

  • Select the task to be started in the task queue interface.
  • Click the “Start” button, and the device will automatically perform the analysis according to the task settings.

Task Monitoring

  • View the task status (e.g., in progress, completed, canceled) in the task queue interface.
  • Pause, resume, or cancel tasks as needed.

3.4 Daily Operation Precautions

  • Sample order: Ensure that the order of samples in the tray matches the settings in the task queue.
  • Syringe cleaning: Regularly clean syringes to prevent cross-contamination.
  • Device status monitoring: Closely monitor the device operation status to promptly identify and resolve issues.
  • Data backup: Regularly back up important data and methods on the device to prevent loss.

Chapter 4 Maintenance

4.1 Daily Maintenance

  • Clean the device: Regularly clean the device exterior and internal components to prevent the accumulation of dust and dirt.
  • Check syringes: Regularly inspect the sealing and flexibility of syringes and replace them if necessary.
  • Lubricate moving parts: Lubricate moving parts according to the recommendations in the manual to ensure smooth device operation.
  • Check electrical connections: Regularly inspect all electrical connections for firmness and reliability to avoid poor contact.

4.2 Periodic Maintenance

  • Replace consumables: Regularly replace consumables (such as syringe needles and seals) according to the recommendations in the manual.
  • Calibrate the device: Regularly calibrate the device to ensure the accuracy and repeatability of analytical results.
  • Software upgrade: Promptly upgrade the device software according to notifications from CTC Analytics AG to obtain the latest features and improvements.

4.3 Maintenance Plan

  • Daily maintenance: Clean the device exterior and check the syringe status.
  • Weekly maintenance: Lubricate moving parts and check electrical connections.
  • Monthly maintenance: Replace consumables and calibrate the device.
  • Annual maintenance: Conduct a comprehensive inspection of device performance and perform a software upgrade (if necessary).

Chapter 5 Troubleshooting

5.1 Common Faults and Solutions

5.1.1 No Detector Signal

Possible causes:

  • Syringe blockage or damage.
  • Incorrect installation of the injection valve needle guide or seal.
  • Incorrect connection of injection valve ports.

Solutions:

  • Clean or replace the syringe.
  • Reinstall the injection valve needle guide and seal.
  • Check and reconnect the injection valve ports.

5.1.2 Sample Not Injected

Possible causes:

  • Incorrect setting of the injection needle penetration depth.
  • Insufficient sample volume.
  • Incorrect installation of the injection valve rotor.

Solutions:

  • Adjust the injection needle penetration depth.
  • Increase the sample volume.
  • Reinstall the injection valve rotor, ensuring the correct orientation.

5.1.3 Injection Unit Collision

Possible causes:

  • Incorrect object positioning.
  • Incorrect setting of the injection needle Z-axis coordinate.

Solutions:

  • Reposition objects to ensure accurate positioning.
  • Adjust the injection needle Z-axis coordinate.

5.2 Advanced Troubleshooting

For more complex faults, technical support from CTC Analytics AG may be required:

  • Contact technical support: When unable to resolve the fault independently, promptly contact the technical support team of CTC Analytics AG, providing a detailed fault description and device information.
  • Remote assistance: Under the guidance of the technical support team, perform remote fault diagnosis and repair.
  • On-site service: For faults requiring on-site repair, arrange for technicians from CTC Analytics AG to visit the site for maintenance.

Chapter 6 Advanced Features and Applications

6.1 Synchronous and Output Signals

The HTC PAL autosampler supports synchronous and output signal functions, enabling synchronous operation with other devices (such as chromatographs and data acquisition systems):

  • Synchronous signals: Used to control the device to wait or continue executing sample processing steps at specific time points.
  • Output signals: Used to send status or completion signals to external devices, indicating the completion of specific processing steps.

6.2 Custom Cycles and Macros

The HTC PAL autosampler supports user-defined cycles and macro functions to meet more complex analytical requirements:

  • Custom cycles: Users can create custom sample processing cycles according to actual needs, including specific injection, cleaning, and movement steps.
  • Macro functions: Through macro functions, users can combine multiple operation steps into a single macro command to simplify the operation process.

6.3 Multitasking and Priority Settings

The HTC PAL autosampler supports multitasking functionality, enabling the simultaneous management of multiple sample analysis tasks:

  • Task priority: Users can set priorities for different tasks to ensure that important tasks are executed first.
  • Task scheduling: The device automatically schedules the execution order of tasks based on task priority and start time.

Chapter 7 Conclusion and Outlook

7.1 Conclusion

This guide provides a detailed introduction to the user manual of the CTC Analytics AG HTC PAL autosampler, covering aspects from device overview, pre-operation preparations, daily operations, maintenance, to troubleshooting. Through the guidance in this guide, users can better understand and use the HTC PAL autosampler, improving analytical efficiency and result accuracy.

7.2 Outlook

With the continuous development of analytical technology, the HTC PAL autosampler will continue to play an important role in fields such as chemical analysis, pharmaceuticals, and environmental monitoring. In the future, the HTC PAL autosampler is expected to further integrate intelligent and automated functions, providing a more convenient and efficient user experience. Meanwhile, with the application of new materials and technologies, the performance and stability of the HTC PAL autosampler will also be further enhanced.

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User Guide for Thermo Scientific Flash 2000 Organic Elemental Analyzer Manual

Introduction

The Thermo Scientific Flash 2000 Organic Elemental Analyzer is a highly efficient and precise instrument widely used in chemistry, materials science, environmental science, food science, and other fields. It employs dynamic flash combustion and high-temperature pyrolysis technologies to rapidly and accurately determine the content of elements such as carbon, hydrogen, nitrogen, sulfur, and oxygen in organic or inorganic solid substances. This guide aims to provide a comprehensive manual for users to better understand and operate the Flash 2000 Organic Elemental Analyzer, ensuring accurate and reliable experimental results.

I. Instrument Overview

1.1 Instrument Features

The Flash 2000 Organic Elemental Analyzer incorporates the performance of both FlashEA 1112 and TC/EA instruments, featuring the following notable characteristics:

  • Dual-Furnace System: It integrates two independent single-furnace systems internally—one for dynamic rapid combustion (CHNS/O mode) and another for high-temperature pyrolysis (HT mode). These furnaces can operate simultaneously or independently for the determination of different elements.
  • Full Automation: The instrument automates the entire process, including sample injection, combustion/pyrolysis, gas separation, and detection, without manual switching.
  • High Sensitivity: Utilizing a Thermal Conductivity Detector (TCD) combined with precise gas chromatography separation technology, it ensures highly accurate detection results.
  • Versatility: Supports multiple analysis modes, including CHNS, O, NCS, NC, S, etc., meeting various experimental needs.
  • User-Friendly Interface: Equipped with Eager Xperience software, it provides an intuitive operating interface and rich data analysis functions.

1.2 Application Scope

The Flash 2000 Organic Elemental Analyzer is suitable for analyzing various solid and liquid samples, including but not limited to:

  • Environmental Monitoring: Soil, sediments, sludge, mud, mineral slurry, coal slurry, etc.
  • Chemical and Pharmaceutical Products: Fine chemicals, pharmaceutical products, catalysts, organometallic compounds, etc.
  • Petrochemical and Energy: Coal, graphite, coke, crude oil, fuel oil, petroleum, etc.
  • Physical Properties: Cement, ceramics, glass fiber, tires, fuels, etc.

II. Instrument Installation and Startup

2.1 Pre-Installation Preparation

  • Confirm Environmental Conditions: Ensure the laboratory environment meets the instrument’s requirements, including temperature, humidity, altitude, and electromagnetic environment.
  • Check Accessories: Verify that all components, including the instrument host, accessories, and consumables, are complete by referring to the packing list.
  • Prepare Gas Sources: Ensure the pressure of helium and oxygen cylinders meets the requirements (typically 0.3-0.35 MPa) and connect them to the instrument’s gas circuit system.

2.2 Instrument Installation

  • Place the Instrument: Position the instrument steadily on the laboratory bench, avoiding vibrations and direct sunlight.
  • Connect Gas Circuits: Follow the manual’s diagrams to correctly connect the helium and oxygen cylinders to the instrument’s gas inlets, ensuring airtightness.
  • Connect Power: Plug the instrument’s power cord into a suitable power outlet and ensure proper grounding.
  • Install Software: Install the Eager Xperience software on the computer and perform necessary system configurations.

2.3 Instrument Startup

  • Open Gas Sources: Slowly open the valves of the helium and oxygen cylinders and adjust the pressure regulators to the specified pressure.
  • Power On: Press the power switch on the back of the instrument to start it.
  • Initialize Software: Launch the Eager Xperience software and perform initial instrument setup.
  • Preheat Instrument: Allow the instrument to preheat to a stable operating state according to the manual’s requirements (usually several hours).

III. Sample Preparation and Injection

3.1 Sample Preparation

  • Sample Types: Prepare solid or liquid samples based on analytical needs. Solid samples should be ground into a uniform fine powder, while liquid samples should be accurately weighed.
  • Sample Quantity: Weigh an appropriate amount of sample (typically 2-5 mg) according to the manual’s recommendations to ensure accurate analysis results.
  • Packaging Materials: Use dedicated tin or silver cups to package samples, avoiding contamination and loss.

3.2 Injection Operations

  • Automatic Injection: Place the prepared samples into the autosampler tray and set the injection sequence following the software’s prompts.
  • Manual Injection: If manual injection is required, use a dedicated syringe to inject liquid samples into the reaction chamber or follow the manual’s guidance to place solid samples into the reaction tube.
  • Injection Sequence: Set the injection sequence in the Eager Xperience software, including sample names, file names, and the number of injections.

IV. Instrument Operation and Parameter Settings

4.1 Instrument Operation

  • Select Analysis Mode: Choose the appropriate analysis mode (e.g., CHNS, O, NCS) based on experimental requirements.
  • Set Furnace Temperatures: Configure the heating temperatures of the left and right furnaces according to the analysis mode. For example, in CHNS analysis mode, the left furnace temperature is typically set to 950°C, and the right furnace temperature to 650°C.
  • Gas Flow Settings: Set the flow rates of the carrier gas (helium) and reference gas (helium or oxygen) to ensure stable gas separation in the chromatographic column.
  • Oxygen Injection Time: Set the duration and flow rate of oxygen injection based on sample combustion requirements to ensure complete sample combustion.
  • Detector Settings: Adjust the sensitivity and baseline level of the TCD detector to ensure stable and accurate detection signals.

V. Data Analysis and Result Processing

5.1 Data Acquisition

  • Real-Time Monitoring: Monitor the chromatogram and detection signals in real-time through the Eager Xperience software during the analysis process to ensure smooth progress.
  • Data Recording: The software automatically records all data during the analysis process, including peak areas, retention times, and other key information.

5.2 Data Analysis

  • Peak Identification and Integration: The software automatically identifies element peaks in the chromatogram and performs integration calculations to determine the content of each element.
  • Calibration Curve: Establish a calibration curve using standard samples to ensure the accuracy and reliability of analysis results.
  • Result Calculation: Based on the calibration curve and sample peak areas, the software automatically calculates the content of each element in the sample and generates a detailed analysis report.

5.3 Result Processing

  • Data Export: Export the analysis results in Excel or other formats for further data processing and analysis.
  • Report Generation: Generate detailed reports containing analysis results, calibration curves, chromatograms, and other information based on experimental needs.
  • Result Verification: Validate the analysis results by repeating experiments or using different standard samples to ensure stability and accuracy.

VI. Instrument Maintenance and Troubleshooting

6.1 Routine Maintenance

  • Clean Reaction Tubes: Regularly clean the reaction tubes to remove residues and carbon deposits, ensuring unobstructed and efficient reaction tubes.
  • Replace Adsorption Filter Materials: Replace adsorption filter materials regularly based on usage to ensure optimal gas separation effects.
  • Check Gas Circuit System: Periodically inspect the gas circuit system for airtightness and connections to ensure stable and safe gas supply.

6.2 Periodic Maintenance

  • Replace Chromatographic Columns: Replace chromatographic columns based on their lifespan and analytical performance to ensure separation efficiency.
  • Calibrate Instrument: Regularly calibrate the instrument using standard samples to ensure the accuracy and reliability of analysis results.
  • Software Upgrades: Stay updated with software upgrades and update the Eager Xperience software promptly to obtain improved operational experiences and data analysis functions.

6.3 Troubleshooting

  • Instrument Fails to Start: Check power connections, gas supply, and instrument status indicators to排除 (exclude) power and gas supply issues.
  • Abnormal Analysis Results: Inspect sample preparation, injection operations, and parameter settings to排除 (exclude) operational errors and improper parameter configurations.
  • Gas Circuit System Failures: Check the airtightness, connections, and gas flow settings of the gas circuit system to排除 (exclude) gas circuit system failures.
  • Detector Signal Abnormalities: Inspect detector settings, baseline levels, and signal stability to排除 (exclude) detector failures.

VII. Safety Precautions

7.1 Operational Safety

  • Wear Protective Gear: Wear lab coats, gloves, and goggles during operations to ensure personal safety.
  • Follow Operating Procedures: Strictly adhere to the manual’s and software’s instructions to avoid safety accidents caused by违规 (non-compliance) operations.
  • Ensure Adequate Ventilation: Ensure the laboratory is well-ventilated to prevent the accumulation of harmful gases, which could harm operators.

7.2 Instrument Safety

  • Regular Instrument Inspections: Conduct regular comprehensive inspections of the instrument to ensure it is in good working condition.
  • Avoid Vibrations and Impacts: Prevent vibrations and impacts to the instrument during handling and use to avoid damaging internal components.
  • Prompt Maintenance and Repairs: Contact professional maintenance personnel promptly for maintenance and repairs upon discovering instrument faults or abnormalities to ensure normal instrument operation.

VIII. Conclusion

The Thermo Scientific Flash 2000 Organic Elemental Analyzer is a highly efficient and precise instrument for elemental analysis. Through this comprehensive user guide, users can better understand and operate the instrument, ensuring accurate and reliable experimental results. During actual operations, users should strictly adhere to operating procedures and safety precautions, regularly maintain and service the instrument to extend its lifespan and improve analytical efficiency. Additionally, users should stay updated with software upgrades and technical support services to obtain an improved operational experience and data analysis capabilities.

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ACS580 Inverter: Motor Overload Fault Diagnosis and Parameter Optimization in Torque Control for Hydraulic Presses

I. Introduction

In the field of modern industrial automation, inverters serve as the core equipment for motor control and are widely applied in hydraulic press systems. The ABB ACS580 series of inverters are highly efficient, reliable, and flexible, supporting torque control mode. They can precisely regulate the motor’s output torque to achieve stable pressure output in hydraulic systems, avoiding energy waste and mechanical shocks associated with traditional fixed-speed operation. However, in practical applications, motor overload faults (such as the 7122 code) are common. Even when the actual torque does not exceed 80%, continuous operation for more than 10 minutes may trigger the fault, leading to production interruptions. Based on the ACS580 firmware manual and actual cases, this paper explores the principles of torque control, the causes of the 7122 fault, diagnostic methods, and parameter optimization strategies. The torque control mode in hydraulic presses emphasizes constant load output, and low-speed, high-torque operation amplifies the risk of motor heat accumulation. Reasonable configuration of parameter group 35 (motor thermal protection) and group 97 (motor control) can mitigate faults and enhance system stability.

II. Overview of the ACS580 Inverter

(A) Basic Information

The ACS580 is a high-performance product in the ABB general-purpose drive series, designed specifically for industrial applications. It supports a power range of 0.75 kW to 500 kW and is suitable for 380 – 480 V AC power supplies. With a modular structure, it features a built-in control panel (ACS-AP-S or ACS-AP-I) for convenient parameter setting and fault diagnosis.

(B) Core Features

  • Diverse Control Modes: It supports scalar control and vector control. Scalar control is suitable for simple frequency regulation, while vector control provides precise torque and speed control. In hydraulic presses, torque control is often combined with scalar mode to achieve stable pressure.
  • Protection Mechanisms: It incorporates a built-in motor thermal model (I²t algorithm) that monitors current, frequency, and time to accumulate heat and prevent overloading. It also supports input from external temperature sensors (such as Pt100 or KTY84) to enhance protection accuracy.
  • Communication and Integration: It has a built-in Modbus RTU fieldbus and can be extended to support protocols such as PROFIBUS and EtherNet/IP, facilitating integration with PLCs or upper-level computers.
  • Energy Efficiency: The energy optimizer function reduces magnetic flux losses under light loads, saving 1 – 20% of electrical energy. This significantly reduces no-load losses during intermittent operation of hydraulic presses.

(C) Application in Hydraulic Presses

The ACS580 regulates the pump motor’s output through torque control mode to achieve pressure closed-loop control, reducing mechanical components and maintenance costs compared to traditional proportional valve control. It performs excellently in heavy-duty machinery and can handle low-speed, high-load scenarios.

III. Principles of Torque Control Mode

(A) Vector Control

It achieves independent regulation by decoupling the motor’s magnetic flux and torque components. The torque setpoint is calculated by a PI controller, and PWM signals are output to control the inverter. The formula is: T=23​×p×LrLm​​×iq​×ψd​, where T is the torque, p is the number of pole pairs, iq​ is the torque current, and ψd​ is the magnetic flux linkage. This mode offers high precision and is suitable for dynamic loads, but requires ID operation to identify motor parameters.

(B) Scalar Control

It employs simple U/F control, where the voltage is kept proportional to the frequency. Torque is indirectly regulated through current, and it is susceptible to slip at low speeds. The setting of the U/F ratio is crucial. A linear ratio (Uf) is suitable for constant-torque applications such as hydraulic presses, while a square ratio (Uf2) is used for variable-torque loads like fans. In the manual, parameter 97.20 (U/F ratio) defaults to linear, but improper user settings (such as setting it to square) can lead to insufficient voltage at low speeds, increased current, and accelerated heat accumulation.

(C) Application Principles in Hydraulic Presses

In hydraulic presses, torque control is used for pressure feedback closed-loop control. Sensors monitor the cylinder pressure, and a PID controller regulates the torque setpoint. Low-speed, high-torque operation is common, and self-cooling motors have poor heat dissipation and are prone to overheating. The control chain is as follows: the setpoint source (AI1/AI2) is selected, processed by a function, and then output through a ramp to a limit module. At low speeds, insufficient magnetic flux (due to U/F mismatch) can cause current peaks and trigger thermal protection. It is necessary to ensure IR compensation in scalar mode to enhance low-frequency torque.

IV. Analysis of the 7122 Fault

(A) Fault Definition

The 7122 fault indicates motor overload, which occurs when the temperature calculated by the drive’s thermal model exceeds the threshold. Even when the torque is less than 80%, accumulated heat can trigger the fault. According to the manual, it is based on the I²t algorithm, which monitors the integral of current squared over time. When the motor overload level (parameter 35.05) reaches 100%, a trip occurs.

(B) Fault Causes

  • Thermal Model Mechanism: The model uses parameters 35.51 (zero-speed load, default 70%), 35.52 (corner frequency, 50 Hz), and 35.53 (corner load, 100%) to define the load curve. At low speeds, the allowable load decreases linearly to the zero-speed value. The formula is: Allowable load = Zero-speed load + (Corner load – Zero-speed load) × (f / f_corner), where f is the current frequency. When users operate at low speeds with a sustained torque close to the allowable value, heat accumulation can trigger the fault.
  • Application Mismatch: Hydraulic presses operate at low speeds with high torque, and cooling is often insufficient. Setting the U/F to square results in low voltage at low frequencies, requiring higher current to maintain torque and increasing heat losses.
  • Conservative Parameters: Users may set parameters such as 35.51 and 35.52 too loosely, but overestimating the ambient temperature (parameter 35.54) accelerates heat accumulation. Additionally, large errors in sensorless estimation can also contribute to the problem.
  • External Factors: High ambient temperatures, blocked motor ventilation, and cable problems can amplify the risk. The 7122 fault is often caused by incorrect motor data or sudden load changes.

V. Case Study

(A) Parameter Analysis

Based on the user-provided parameter photos, the motor data is as follows: 99.04 = scalar, 99.06 = 69.6 A, 99.07 = 380 V, 99.10 = 1450 rpm, and power = 37 kW. The control mode: 19.12/19.16 = torque, 26.11 = AI1. Thermal protection: 35.51 = 130%, 35.52 = 80%, 35.54 = 90°C, 35.57 = Class 30. U/F: 97.20 = square. The operating data shows a torque of 80%, a speed of 300 rpm, and a current of 56.3 A. The thermal model reaches 100% after 10 minutes of fault occurrence.

(B) Problem Diagnosis

The square U/F setting results in high current at low speeds, and the overestimated ambient temperature setting accelerates the I²t accumulation. At 10 Hz, the allowable load = 80% + (130% – 80%) × (10/50) = 90%, and the actual 80% exceeds the limit, leading to accumulation and triggering the 7122 fault, which is often caused by low-speed overloading. To resolve this, the load curve and U/F settings need to be adjusted.

VI. Parameter Optimization Guide

(A) Check Motor Data

Check the motor data in group 99 to ensure it matches the nameplate specifications and avoid underestimating the rated current. Set 99.04 = vector (requires ID operation) to improve accuracy.

(B) Adjust the U/F Ratio

Set 97.20 = linear to ensure sufficient magnetic flux at low speeds. The formula is U=Un​×(f/fn​)+IR compensation (97.13 = 10 – 20%).

(C) Optimize Thermal Protection

  • 35.51 Corner load: Increase from 130% to 150% (if forced cooling is available).
  • 35.52 Zero-speed load: Increase from 80% to 90%.
  • 35.53 Corner frequency: Decrease from 50 Hz to 30 Hz to expand the high-load area.
  • 35.55 Thermal time constant: Increase from 256 s to 500 s.
  • 35.56 Overload action: Change from fault to warning (monitor without tripping).
  • 35.57 Overload class: Set to Class 30 (highest).
  • Enable sensor: Set 35.11 = KTY84 and connect it to AI.

(D) Monitoring and Testing

Monitor parameter 35.05 during operation. If it exceeds 88%, issue a warning and optimize the curve. Use Drive Composer to record data.

(E) Other Optimizations

  • Match the torque limits (30.19/30.20) to the application requirements.
  • Enable the energy optimizer (45.11 = allow) to save energy.
  • After adjustment, restart and test, observing for 10 minutes to ensure no faults occur.

VII. Best Practices and Prevention

(A) Temperature Monitoring

Prioritize the use of external sensors to avoid estimation errors.

(B) Load Matching

When selecting equipment, ensure that the VFD power is at least 1.5 times that of the motor and consider low-speed derating.

(C) Maintenance

Regularly clean the ventilation and check the cables. Use automatic reset (31.12) to handle intermittent faults.

(D) Software Tools

Use Drive Composer to diagnose the thermal curve and simulate optimizations.

(E) Green Applications

VFDs can reduce energy consumption by 20%. Combined with PFC multi-pump control, they can optimize hydraulic systems.

VIII. Conclusion

The 7122 fault in the ACS580’s torque control for hydraulic presses mainly stems from heat accumulation and parameter mismatch. By optimizing group 35 and group 97 parameters, the fault can be effectively resolved, ensuring stable operation. This strategy improves production efficiency, reduces energy consumption, and promotes green manufacturing. In practical applications, it is necessary to combine field testing and, if necessary, consult ABB support.

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A Systematic Diagnostic and Troubleshooting Guide for Abnormal Startup of Malvern Mastersizer Particle Size Analyzer

——Practical Analysis Based on HandleException / Default Policy Software Errors

Abstract
The Malvern Mastersizer series of laser particle size analyzers are widely used in laboratories and industrial quality inspection fields. However, abnormalities during software startup are not uncommon. This paper provides an in-depth analysis of the typical error message “An unexpected exception occurred while calling HandleException with policy ‘Default Policy'” that occurs during the startup process. It dissects the issue from the perspectives of the software framework, runtime library dependencies, instrument hardware communication, Aero dry dispersion module, and the Windows system level, offering a complete diagnostic logic, troubleshooting process, and solution ideas for third-party maintenance engineers and equipment managers.

I. Introduction: Why is Malvern Mastersizer prone to startup abnormalities?
The Mastersizer series (including models 2000, 3000, and 3000E) are high-precision particle size testing devices that involve multiple modules such as optical measurement modules, laser optical path systems, expansion units, high-speed data acquisition cards, communication links, and PC software environments. An abnormality in any of these modules can lead to software startup failure. In particular, the Mastersizer 3000 software adopts the Microsoft .NET + Enterprise Library exception management framework, resulting in a complex exception structure that is prone to “HandleException” and “Default Policy” related errors.

II. Reproducing the Fault Phenomenon: What does the error message indicate?
When users start the software, they may see a pop-up window labeled “Application Error” with the message “An unexpected exception occurred while calling HandleException with policy ‘Default Policy’. Please check the event log for details about the exception.” This indicates the following:

  • An exception has been captured internally by the software, such as module initialization failure, configuration file reading failure, or device non-response.
  • The “Default Policy” that captures the exception has itself encountered an error. The software uses the Microsoft Enterprise Library Exception Handling Block, and when the default policy fails to execute, the software cannot continue to start.
  • Such errors do not necessarily directly prove instrument damage; they are more likely to reflect issues such as driver abnormalities, missing software dependencies, or disconnected communication links.

III. Analysis of the Mastersizer Software Startup Process: Understanding the root causes of faults from the source

  1. Software loading of its dependent DLLs
    This includes the .NET Framework, VC++ Runtime, Malvern core module DLLs, and Enterprise Library configuration files, among others. If any DLLs are missing or corrupted, startup abnormalities will occur.
  2. Software reading of configuration files
    This involves instrument model information, recently used module configurations, communication ports, laser initialization parameters, and dispersion module configurations. Reading failures will trigger exceptions.
  3. Instrument communication initialization
    The communication link for the Mastersizer 3000 may be USB, fiber optic, or RS-232. If the software does not receive a response from the instrument during the initialization stage, an exception will be thrown, especially when there are abnormalities in the Aero dry dispersion module.
  4. Optical system initialization
    Failure to turn on the laser drive, non-response from the optical path unit, or no return from the ADC data acquisition card can also lead to software startup failure.
  5. Software UI loading
    This stage is unlikely to cause HandleException unless there is damage to system fonts or abnormalities in Windows graphical components.

IV. Typical root causes that may lead to HandleException (ranked by probability)

  1. Instrument communication failure (highest probability)
    Examples include loose or damaged USB cables, use of incompatible USB-HUBs, uninstalled or corrupted USB drivers, and Aero modules that are not powered on or have internal communication board failures.
  2. Corrupted or missing .NET Framework (very common)
    The software relies on .NET 3.5 and .NET 4.0/4.5. Windows updates, viruses, or incorrect software uninstallation can damage these components.
  3. Missing VC++ runtime libraries (often overlooked but very critical)
    Malvern uses a large number of C++ modules internally, and missing VC++ Runtime libraries will prevent the program from loading.
  4. Corrupted local configuration files of Malvern software
    Corruption or formatting errors in files such as software.config, exception.config, and user.config can prevent the Enterprise Library from reading them, triggering Default Policy errors.
  5. Windows permission issues
    Examples include the program being unable to write to ProgramData, the software not having administrator privileges, or company IT-installed antivirus systems blocking access to key files.
  6. Host and dispersion hardware issues
    These include damage to the Aero fan module, inability of the control board to power on, abnormal sensor output, or interrupted data links.

V. Complete on-site troubleshooting process (standard operating procedure for engineers)
Step 1: Confirm physical connections and power-on status
Check all USB/fiber optic communication cables, unplug and replug them, avoid using USB-HUBs, confirm that both the Mastersizer host and Aero are powered on, and observe whether the LED indicators are normal.
Step 2: Restart the device and computer
The recommended sequence is to close the software, turn off the instrument, restart the computer, turn on the instrument, and then open the software. This is the reset method recommended by Malvern.
Step 3: Check the Windows event log (critical)
Navigate to “Event Viewer → Windows Logs → Application” and search for relevant logs such as Malvern, Mastersizer, .NET Runtime, and Application Error to obtain detailed exception sources.
Step 4: Repair system runtime libraries
Install .NET Framework 3.5, .NET Framework 4.0/4.5, and VC++ 2005/2008/2010/2012/2013 runtime libraries. You can use the Microsoft .NET Repair Tool and the Visual C++ Redistributable Package collection to perform repairs.
Step 5: Reset or delete software configuration files (commonly effective)
Delete the configuration files in the C:\Users\username\AppData\Local\Malvern\ and C:\ProgramData\Malvern\ directories. The software will automatically regenerate them.
Step 6: Reinstall the software (ultimate solution)
This is suitable for situations such as software corruption, abnormal configuration files, missing DLLs, or interference from enterprise antivirus software. A complete reinstallation will almost restore normal operation.

VI. Special case: Abnormalities caused by the Aero dry dispersion module
In the Mastersizer + Aero dry dispersion module combination system, the Aero contains components such as a motor drive, differential pressure sensor, control CPU board, and speed feedback system. If the Aero’s internal hardware is damaged, error messages such as “Unexpected exception” and “Failed to initialize module: Aero” will appear during the software initialization stage. If you observe no indicator lights when the Aero is powered on, no startup action of the suction fan, abnormal fan current, or non-operation of the internal fan on-site, the problem may be concentrated on damage to the Aero control board or fan drive board.

VII. Best advice for engineers

  • Confirm communication lines and device power-on status: Re-plug the communication lines and avoid using USB-HUBs.
  • Restart the device and computer: Follow the correct restart sequence.
  • Check the event log: Obtain detailed exception information.
  • Repair the .NET Framework and VC++ Runtime: Ensure that software dependencies are complete.
  • Exclude equipment hardware abnormalities (especially Aero): Focus on the fan, control board, and power module.
  • Reinstall the software if necessary: Use this as the final solution.

VIII. Conclusion: The essence and solution direction of Mastersizer startup abnormalities
The error “An unexpected exception occurred while calling HandleException with policy ‘Default Policy'” analyzed in this paper is, from a software structure perspective, a secondary exception caused by the failure of the software’s exception handling mechanism. However, the root causes often lie in system runtime libraries, drivers, configuration files, communication links, or abnormal initialization of instrument modules (especially Aero). Through a systematic diagnostic process, almost 100% of the problems can be located.

IX. Appendix: On-site troubleshooting checklist for engineers (printable)
✔ Communication check

  • Loose USB/fiber optic cables
  • Whether the HUB has been removed
  • Whether the instrument is properly powered on
    ✔ Software environment
  • .NET Framework 3.5/4.x
  • Integrity of VC++ Runtime
  • Whether the software has been blocked by enterprise antivirus software
    ✔ Windows system
  • Permissions
  • Event Viewer
  • Whether there are conflicting drivers
    ✔ Instrument hardware
  • Aero fan
  • Control board
  • Internal sensors
  • Host power module
    ✔ Software repair
  • Delete configuration files
  • Reinstall the software

X. Overall Summary
By technically dissecting the startup process of the Malvern Mastersizer particle size analyzer and analyzing the root causes of HandleException / Default Policy errors, it can be concluded that such faults are the result of a comprehensive failure in the coordination of the software, system, drivers, and instrument initialization processes. As long as engineers master the troubleshooting logic proposed in this paper, they can quickly locate and accurately repair most on-site abnormalities.

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In-Depth Analysis of Yaskawa H1000 Inverter OPE04 Fault: A Full-Process Troubleshooting Guide from Hardware Replacement to System Initialization

1. Introduction

In industrial automation control systems, inverters serve as the core equipment for motor drive, and their stability directly impacts the continuous operation of production lines. The Yaskawa H1000 series inverter, renowned for its high-precision vector control, rich functional expansion, and reliable hardware design, is widely used in scenarios such as fans, pumps, conveyor belts, and machine tools. However, in practical maintenance, the OPE04 fault (Motherboard Replacement Detection Fault) is one of the most common issues encountered by technicians—it can be triggered by either actual motherboard replacement or hardware contact failures/system false alarms. If mishandled, this fault may render the inverter unable to start normally, even affecting the efficiency of the entire production line.

This article delves into the essence of the OPE04 faulthardware logic, and software mechanisms to provide technicians with scenario-based troubleshooting processespreventive maintenance strategies, and practical case validations. The goal is to help technicians quickly locate issues, standardize operations, and ensure the inverter returns to stable operation.

2. Definition and Triggering Mechanism of OPE04 Fault

2.1 Official Interpretation of the Fault Code

According to the Yaskawa H1000 series inverter manual, OPE04 stands for “Board Replace Detect” (Motherboard Replacement Detection). Its core meaning is: The inverter’s control system detects a change in the control motherboard and requires an initialization operation to confirm the motherboard replacement status.

In simple terms, this is a “self-protection mechanism” of the inverter—the control motherboard is the “brain” of the inverter, storing user-defined parameters (e.g., motor rated power, acceleration/deceleration time, vector control parameters), operation logic (e.g., V/F curve, PID adjustment), and communication configurations (e.g., Modbus, Profibus). When the motherboard is replaced, the default parameters of the new motherboard may conflict with the original system parameters. Without “confirmation,” the inverter cannot guarantee operational consistency, so it triggers the OPE04 fault to force the user to complete initialization.

2.2 Triggering Scenarios for OPE04 Fault

The OPE04 fault is triggered in two categories: active scenarios and passive scenarios:

  • Active Scenario: The user proactively replaces the control motherboard due to damage (e.g., capacitor breakdown, chip burnout) or functional upgrades (e.g., replacing with a motherboard supporting a higher communication protocol).
  • Passive Scenario: No proactive motherboard replacement occurs, but the system falsely detects a “motherboard replacement” due to hardware contact failures (e.g., loose motherboard connectors, oxidation) or motherboard firmware abnormalities (e.g., program runaway).

3. Hardware Root Causes of OPE04 Fault: The “Core Status” and Replacement Specifications of the Control Motherboard

3.1 Functions and Structure of the Control Motherboard

The control motherboard (usually marked as the “CPU board”) of the Yaskawa H1000 inverter is the control center of the entire system. Its core components include:

  • CPU Chip: Responsible for calculating control algorithms (e.g., vector control, PID adjustment) and processing user commands (e.g., start/stop, frequency setting).
  • Memory Chips: Divided into non-volatile memory (e.g., EEPROM, stores user parameters) and volatile memory (e.g., RAM, stores runtime data).
  • Interface Circuits: Connects the power board, driver board, operation panel, and external devices (e.g., sensors, PLCs) to enable signal transmission and communication.

If the motherboard is damaged, the inverter loses all control capabilities (e.g., unresponsive to operation panel commands, motor failure to start) and must be replaced.

3.2 Standardized Operations for Motherboard Replacement

When replacing the control motherboard, the following steps must be strictly followed to avoid subsequent faults:

  • Power-Off Operation: Cut off the inverter’s input power (including main power and control power) and wait 5–10 minutes to discharge the DC bus capacitor (to avoid electric shock or damage to the new motherboard).
  • Anti-Static Measures: Wear an anti-static wrist strap to prevent electrostatic discharge (ESD) from damaging sensitive components on the motherboard (e.g., CMOS chips).
  • Connector Installation: The connection between the motherboard and the base plate usually uses pin headers + sockets or flat cables. Ensure the connector is fully inserted and not skewed (check the positioning marks on the connector).
  • Fixing Screws: Use a suitable screwdriver to tighten the fixing screws—avoid over-tightening (which may deform the motherboard) or under-tightening (which may cause poor contact).

4. Software Logic of OPE04 Fault: The “Necessity” and “Operation Process” of Initialization

4.1 Why Is “Motherboard Replacement Confirmation” Required?

The parameter system of the Yaskawa H1000 inverter uses a double-layer structure of “factory parameters + user parameters”:

  • Factory Parameters: Stored in the motherboard’s non-volatile memory, these are the “default configurations” of the inverter (e.g., Pr. 0 = 0 for V/F control; Pr. 1 = 60Hz for rated frequency).
  • User Parameters: Parameters modified by the user based on actual applications (e.g., Pr. 3 = 380V for motor rated voltage; Pr. 7 = 5s for acceleration time), usually stored in EEPROM.

When replacing the motherboard, the factory parameters of the new motherboard may conflict with the user parameters of the original system (e.g., the original system uses vector control, but the new motherboard defaults to V/F control). Without “confirmation,” the inverter may fail to operate normally (e.g., motor start failure, speed fluctuations). Therefore, Yaskawa designs the “motherboard replacement confirmation” function to allow the system to recognize the new motherboard and load correct parameters by modifying specific parameters (e.g., Pr. 777).

4.2 Initialization Process After Motherboard Replacement (Core Steps)

If the OPE04 fault is triggered by proactive motherboard replacement, follow these steps to complete initialization (taking the Yaskawa H1000 series as an example; details may vary by firmware version—refer to the corresponding manual):

Step 1: Prepare Work

  • Backup Original Parameters (if possible): If the original motherboard is not completely damaged, back up user parameters via the operation panel or Yaskawa’s dedicated software (e.g., DriveWizard) to avoid losing critical configurations after initialization.
  • Tool Preparation: Phillips screwdriver, anti-static wrist strap, operation panel (JVOP-180, the digital operator in the picture).

Step 2: Enter Parameter Mode

  • Press the ESC key to exit the fault display and return to standby (screen shows “STOP”).
  • Long-press the MODE key (for ~3 seconds) until the screen displays “Pr. 0” (indicating entry into parameter mode).

Step 3: Locate the “Motherboard Replacement Confirmation” Function Code

The “motherboard replacement confirmation” function code for the Yaskawa H1000 series is usually Pr. 777 (some versions may use Pr. 778 or others—refer to the manual). The parameter values mean:

  • 0: Motherboard replacement not confirmed (default, triggers OPE04 fault).
  • 1: Motherboard replacement confirmed (initialization completed, fault eliminated).

Step 4: Modify the Parameter Value

  • Use the ↑/↓ keys to change Pr. 777 from “0” to “1”.
  • Press the ENTER key to confirm the modification (screen shows “Pr. 777=1”).

Step 5: Restart the Inverter

  • Cut off the inverter power and wait 1 minute before re-energizing.
  • After power-on, if the screen shows “RUN” or “STOP” (no fault code), the initialization is successful, and the OPE04 fault is eliminated.

5. Troubleshooting OPE04 Fault Without Motherboard Replacement: Hardware Contact and System False Alarms

If the OPE04 fault is triggered without proactive motherboard replacement, it is usually caused by hardware contact failures or system false alarms. Follow these steps to troubleshoot:

5.1 Check Hardware Contact Failures

Step 1: Disconnect Power

  • Cut off the inverter’s input power and wait for the DC bus capacitor to discharge (use a multimeter to measure the DC bus voltage to ensure it is below 36V).

Step 2: Open the Inverter Casing

  • Use a Phillips screwdriver to remove the casing fixing screws and open the cover (avoid damaging internal components).

Step 3: Inspect Motherboard Connections

  • Locate the connector between the control motherboard and the base plate (usually on the edge of the motherboard, marked as “CN1” or “CN2”).
  • Gently pull out the connector and check if the pins are oxidized (e.g., blackened pin surface), bent (e.g., skewed pins), or dirty (e.g., dust, oil).
  • Wipe the pins and socket with anhydrous alcohol (do not use gasoline or acetone to avoid corrosion). After the alcohol evaporates, reinsert the connector (ensure full insertion, no skewness).

Step 4: Reinstall the Casing and Power On

  • Reinstall the casing and tighten the fixing screws.
  • After power-on, if the OPE04 fault disappears, the problem is solved; if not, proceed to the next step.

5.2 Restore Factory Settings (Caution!)

If the hardware contact is good but the fault persists, it may be a system parameter conflict causing a false alarm. You can try restoring factory settings (note: this operation clears all user parameters—back up first):

Step 1: Enter Parameter Mode

  • Press the ESC key to exit the fault display and long-press the MODE key to enter parameter mode.

Step 2: Locate the “Restore Factory Parameters” Function Code

The “restore factory parameters” function code for the Yaskawa H1000 series is usually Pr. 778. The parameter values mean:

  • 0: Keep current parameters (default).
  • 1: Restore factory parameters (clears all user parameters).

Step 3: Restore Factory Parameters

  • Use the ↑/↓ keys to change Pr. 778 to “1”.
  • Press ENTER to confirm— the screen will show “Pr. 778=1” (indicating restoration in progress).
  • Wait ~10 seconds until the screen shows “END” (restoration completed).

Step 4: Reconfigure Parameters and Verify

  • Reconfigure user parameters based on actual applications (e.g., Pr. 3 = motor rated voltage, Pr. 4 = motor rated current).
  • Restart the inverter—if the OPE04 fault disappears, the problem is solved.

6. Preventive Maintenance Strategies for OPE04 Fault

To avoid recurrent OPE04 faults, establish a standardized maintenance process:

6.1 Regular Hardware Inspection

  • Conduct a visual inspection of the inverter quarterly, focusing on whether the motherboard connector is loose or oxidized (oxidized pins will blacken).
  • Perform internal cleaning annually—blow dust off the motherboard surface with compressed air (avoid dust accumulation causing poor contact).

6.2 Standardize Motherboard Replacement Operations

  • When replacing the motherboard, power off and wear an anti-static wrist strap.
  • Before installing the new motherboard, check that its model matches the original (e.g., the H1000 motherboard model is “CIMR-HB4A0150AAA”—confirm the new motherboard’s model).
  • After replacement, initialize (i.e., set Pr. 777 = 1) to avoid triggering the OPE04 fault.

6.3 Backup Parameters

  • Back up the inverter’s user parameters regularly (e.g., quarterly) via the operation panel (select “Parameter Backup” function) or Yaskawa DriveWizard software (connect via RS-485 communication interface).
  • Store backup files on non-volatile media (e.g., USB drive, cloud storage) to avoid parameter loss due to hard disk failure.

7. Practical Case Studies

Case 1: OPE04 Fault After Proactive Motherboard Replacement

Fault Phenomenon: An H1000 inverter (model CIMR-HB4A0150AAA) in a food factory triggered the OPE04 fault after replacing the motherboard due to a capacitor breakdown. The inverter could not start.
Troubleshooting Process:

  1. Confirmed the user had replaced the motherboard and not performed initialization.
  2. Guided the user to enter parameter mode and set Pr. 777 = 1.
  3. After restart, the fault disappeared, and the inverter returned to normal operation.
    Conclusion: After proactive motherboard replacement, initialization is mandatory—otherwise, the OPE04 fault will be triggered.

Case 2: OPE04 Fault Without Motherboard Replacement

Fault Phenomenon: An H1000 inverter (model CIMR-HB4A0150AAA) in a water plant suddenly displayed the OPE04 fault. The user had not replaced the motherboard.
Troubleshooting Process:

  1. Disconnected power, opened the casing, and found oxidation on the CN1 connector pins.
  2. Wiped the pins and socket with anhydrous alcohol and reinserted the connector.
  3. After power-on, the fault disappeared.
    Conclusion: Connector oxidation caused poor contact, and the system falsely detected a “motherboard replacement.” The fault was resolved after cleaning.

8. Conclusion

The OPE04 fault of the Yaskawa H1000 inverter is essentially a system requirement for confirming motherboard changes—whether proactive replacement or passive false alarm, it requires resolution via hardware inspection or software initialization. Technicians must master the following core points:

  1. Fault Definition: OPE04 is a “motherboard replacement detection fault” that requires confirming the motherboard replacement status.
  2. Troubleshooting Process:
    • Proactive motherboard replacement: Set Pr. 777 = 1 to complete initialization.
    • No motherboard replacement: Check hardware contact and restore factory settings if necessary.
  3. Preventive Measures: Standardize replacement operations, inspect connections regularly, and back up parameters.

Through the analysis in this article, I believe technicians can quickly locate the cause of the OPE04 fault and take correct measures to ensure the inverter operates stably. In practical applications, if complex issues arise (e.g., the fault persists after initialization), contact Yaskawa technical support or a professional maintenance personnel to avoid greater losses due to misoperation.

Appendix: Common Function Codes for Yaskawa H1000 Series Inverters

Function CodeNameDefault ValueMeaning
Pr. 777Motherboard Replacement Confirmation00 = Not Confirmed; 1 = Confirmed
Pr. 778Restore Factory Parameters00 = Keep; 1 = Restore Factory Parameters
Pr. 0Control Mode Selection00 = V/F Control; 1 = Vector Control
Pr. 1Rated Frequency60HzRated frequency of the motor
Pr. 3Rated Voltage380VRated voltage of the motor

(Note: Function codes may vary by firmware version—refer to the actual manual.)

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JEOL JSM-IT200 Series Scanning Electron Microscope User Guide

I. Introduction

The JEOL JSM-IT200 series scanning electron microscope (SEM) is a high-performance analytical instrument specifically designed for scientific research and metrology applications. This series features high resolution (below 10 nm), supports both high-vacuum and low-vacuum mode imaging, and offers X-ray energy-dispersive spectroscopy (EDS) for elemental analysis. This user guide aims to assist users in comprehensively mastering the use of the JSM-IT200 series, from safety preparations to advanced operations, ensuring efficient utilization of the instrument.

II. Safety Guidelines

Training and Protection

All users must complete Environmental, Health, and Safety (EH&S) training and wear personal protective equipment (PPE) such as safety glasses and rubber gloves.

Sample Preparation

Avoid using solvents in the SEM chamber to prevent volatile organic compound (VOC) contamination; handle plastic sharp objects properly; links to Material Safety Data Sheets (MSDS), EH&S laboratory safety manuals, and CIF safety manuals are available on the computer desktop.

Instrument Operation

Record any abnormal responses or error states, capture images using the screenshot tool, and notify relevant personnel; promptly report filament failures and replace the Wehnelt cap and spare filaments.

Vacuum System

Wear gloves when exchanging samples and keep the sample holder clean; firmly secure powder samples to prevent damage to the electron gun.

III. System Overview

The JSM-IT200 series consists of an electron optical column (EOS), a sample chamber, a vacuum system, and control software. In terms of software, log in to the instrument computer as the.\cif user and manage logins/logouts using the LockScreen program; the OperationServer icon on the taskbar is a critical background process for SEM operation; the bottom of the desktop contains main programs such as SEM Operation and SMILE VIEW Lab.

IV. Sample Preparation and Loading

Sample Preparation

Samples must be firmly fixed and have moderate conductivity; non-conductive samples require gold coating; powder samples must not be loosely loaded.

Sample Holder

Various types of holders are provided; measure the sample height to prevent collisions.

Loading Process

Follow the guidance of Specimen Exchange Navi, including venting, opening the chamber, entering sample information, setting parameters, adjusting the Z-axis height, closing the chamber door, evacuating the chamber, and starting the electron gun.

V. Software Interface and Operation

Main Interface

Displays real-time images, with the control bar below including zoom, focus, etc.; stage navigation is located in the upper right corner, and the chamber camera helps tilt samples.

Control Options

Include screen buttons and MUI knobs; the mouse wheel controls zooming; in manual mode, adjust focus and astigmatism; automatic astigmatism correction simplifies operations.

Display Histogram

Optimize brightness/contrast settings to ensure no signal clipping.

Advanced Navigation

For example, Holder Graphics displays the current sample position, and the SNS option switches to CCD color images.

VI. Imaging Techniques

Imaging Modes

Include secondary electron images (SEI) and backscattered electron images (BSE), highlighting surface topography and compositional differences, respectively.

Parameter Optimization

Adjust the accelerating voltage, probe current, and magnification according to sample requirements.

Automatic Functions

One-click adjustment of focus, contrast, brightness, and astigmatism; use BED and LSED to obtain images in low-vacuum mode.

Advanced Functions

Such as the Montage function for automated large-area observation and 3D imaging options for creating stereo images and 3D models.

VII. Elemental Analysis (EDS)

Operation

Specify points/lines/areas on the SEM screen for EDS analysis, displaying X-ray spectra and major elements in real time.

Analysis Methods

Include qualitative analysis, quantitative analysis, line analysis, and elemental mapping.

Advanced Functions

Such as QBase database comparison of spectra, PlayBack Analysis for replaying accumulated frames, and GSR analysis for automated classification of gunshot residue particles.

VIII. Data Management and Reporting

Data Management

SMILE VIEW Lab integrates the management of CCD, SEM images, and EDS data, supporting search and position display.

Report Generation

Select data to automatically layout reports, support the creation of templates and one-click updates; output to Word or PowerPoint for easy sharing.

IX. Maintenance and Troubleshooting

Maintenance

Pre-align the filament; gun alignment is fully automatic; when replacing the filament, insert the Wehnelt to automatically center it.

Troubleshooting

Record error states and take screenshots; promptly report filament failures and replace them; follow the procedure when ending a session.

X. Advanced Functions

Zeromag

Seamlessly transition from optical to SEM, supporting multi-analysis position presets and reviews.

Particle Analysis Software

Automatic/manual particle detection, EDS analysis, classification, and statistical graphs.

Language Switching

The UI supports Japanese/English; the vacuum system is fully automatic.

Installation Requirements

Specify power supply, room temperature, humidity, and space requirements.

XI. Conclusion

The JSM-IT200 series simplifies SEM operations and enhances analytical efficiency through integrated software and automatic functions. This guide covers comprehensive steps from safety to advanced applications, and users can apply them according to their specific configurations. Practice is key; by analyzing poor images, optimizing parameters, and utilizing tools such as histograms and automatic corrections, users can ensure instrument reliability and data accuracy, driving innovation in fields such as materials science and biology.

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SMILE VIEW Lab Software Manual User Guide

Introduction

SMILE VIEW Lab is a professional data management and analysis software specially designed by JEOL Ltd. for electron microscope systems. It supports the processing and analysis of data collected from JEOL high-end instruments such as JXA-ISP100, JXA-iHP200F, JSM-F100, and JSM-IT800. It integrates Sample Navigation System (SNS) images, Scanning Electron Microscope (SEM) images, Energy Dispersive X-ray Spectroscopy (EDS) data, and positional information, storing them in project files. This guide aims to provide comprehensive and original technical guidance to help users fully master the software from installation to advanced applications.

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Software Overview and Installation

Core Functions

  • Data Integration: Links sample images, electron microscope images, and EDS results, supporting graphical representation of positions.
  • Analysis Tools: Offers functions such as spectrum editing, one-dimensional comparative spectra, line profiles, and pop-up spectra editing.
  • Advanced Visualization: Supports 3D surface topology reconstruction, viewing at any zoom level and angle, and surface roughness standards conforming to ISO/JIS/ASME.
  • Report Generation: Features an intuitive layout editor, supports PDF/Word export, and multi-page document creation.
  • Compatibility: Seamlessly integrates with specific JEOL models and supports miXcroscopy™ image positioning.

Pre-installation Preparations

  • System Requirements: Windows operating system (Windows 10 or higher recommended), at least 8GB RAM, Intel i5 or equivalent processor, dedicated graphics card (supporting OpenGL), and sufficient storage space.
  • Software License: Non-exclusive and non-transferable; reverse engineering or copying is prohibited.

Installation Steps

  1. Download the installation package (.exe file) from the JEOL official website or authorized channels.
  2. Double-click the installer and select the installation path (default: C:\Program Files\JEOL\SMILE VIEW Lab).
  3. Accept the license agreement and install dependent components such as .NET Framework.
  4. After installation, restart the computer and activate the software with administrator privileges.
  5. If integrating EDS, configure standard data and measurement conditions.
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Starting the Software

Starting Methods

  • Click the “Data” button through SEM Center.
  • Select “Project – Data management” from the File menu.

Starting Process

  1. Ensure that the JEOL instrument is connected and data has been collected.
  2. Open SEM Center and navigate to the data management option.
  3. Click to start, and the software loads the database, displaying the project tab panel.
  4. During the first start, the software may prompt you to configure user accounts (administrator privileges are required for data sharing).

Precautions

  • Avoid operating in environments with high electromagnetic interference and ensure the computer is grounded.
  • Software version information can be viewed under the Help tab.

Screen Configuration

Interface Layout

  • Project Tab Panel: The core data management area, including the Ribbon menu, address bar, project file list, collected data list, and sample image area.
  • Favorite Tab Panel: A collection of shortcuts for quick access to frequently used projects or data.
  • Report Tab Panel: The report management area, supporting preview, deletion, and export of report files.
  • Layout Tab Panel: The layout editor for customizing report templates.

Ribbon Menu

  • Home: Copy projects, import/export data, search, toggle display, and access the recycle bin.
  • Setting: Chemical formula calculation, standard data management, EDS settings, report settings, and measurement conditions.
  • Admin (Administrator Only): Data sharing and database maintenance.
  • Help: Version information.

Mouse and Touch Operations

Supports click selection, right-click menu, drag-and-drop adjustment, and pinch-to-zoom. The interface supports customization, such as changing display formats or sorting data.

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Data Management

Operations from the Ribbon

  • Copy Project: Select a project and click Copy Project.
  • Import Data: Supports importing project/sample unit jlz files.
  • Export Data: Export in jlz format, supporting sample units, reports, and layouts.
  • Search Data: Search for files in the project list.
  • Display Toggle: Classify and display data types.
  • Recycle Bin Operations: Temporarily store deleted files and support recovery.
  • Data Sharing: Administrators set up sharing among users.
  • Version Check: Display the software version.

Project File List Operations

Create new projects, move samples, filter and display formats, and right-click menu operations (rename, send to recycle bin, copy, export, batch analyze spectra, move to other projects).

Sample File Operations

Right-click menu operations (rename, delete, export, batch analysis, move).

Collected Data Operations

Double-click to open the analysis window, and right-click menu operations (open, delete, add to favorites, restore conditions/stage positions, add to report, save as other formats, correspondence program, particle size analysis).

Other Functions

Restore conditions, restore stage positions, add to report, save formats, correspondence program, particle size analysis.

Checking and Editing Collected Data

Opening Collected Data

Select data and double-click to display the analysis window.

Editing Sample Images

Adjust brightness, contrast, rotation, and mark positions.

Editing Electron Microscope Images

Zoom, measure distances/angles, and enhance images.

Spectrum Analysis

Edit one-dimensional comparative spectra, adjust baselines, identify peaks, and quantify.

Line Analysis

Edit profiles, smooth curves, and extract data.

Mapping Analysis

Edit pop-up spectra and adjust line profiles.

Correspondence Program (Image Alignment)

Starting Method

Select Correspondence from the data right-click menu.

Operation Steps

  1. Specify Matching Mode: Automatic positioning or manual.
    • Automatic Positioning: Specify the input image, magnification (Mag), region of interest (ROI), set parameters, and run processing.
    • Manual Positioning: Manually adjust image overlay.
  2. miXcroscopy™ Image Positioning: Specific integration mode.
  3. Fine-tune Partial Images: Move, resize, and rotate.
  4. Adjust Image Quality: Brightness and contrast.
  5. Save Results: Export aligned images.
  6. Scale Space Detection: Use image pyramids to optimize matching.

Report Generation

Screen Configuration

The report creation window includes a layout editor, data list, and preview.

Creating a Report

Select a template and create a new layout base.

Editing a Report

Add data, covers, and headers/footers.

Creating a New Layout

Use the layout editor to add items, adjust positions, and save.

Adding Data

Add from the list or analysis screen, supporting comparison.

Adding Covers/Headers/Footers

Customize text and page numbers.

Exporting Reports

Export as electronic data (PDF/Word) or print.

Transferring Data to Other Computers

Exporting Data

Select projects/samples/reports/layouts and generate jlz files.

Importing Data

Select jlz files and import them into new projects, supporting Windows Explorer drag-and-drop.

Precautions

Ensure compatibility and back up data before transfer.

Database Maintenance Tools

Starting/Closing

Start from the Admin tab and confirm closing.

Backup

Select the source/target and perform backup.

Restore

Restore data from backup.

Path Change

Move the data folder and use backup data.

Error Messages

Handle common issues such as invalid paths.

Troubleshooting

Common Problems

  • Startup Failure: Check the license and system requirements.
  • Data Import Errors: Verify the jlz format.
  • Analysis Window Unresponsiveness: Restart the software and check memory.
  • Report Export Failure: Confirm permissions and update the software.

Contact Information

If problems persist, contact the JEOL service office.

Software Warranty

The warranty period is 12 months, covering hardware/software failures but excluding improper operation.

Conclusion

SMILE VIEW Lab, as a key component of the JEOL ecosystem, significantly enhances the efficiency and accuracy of electron microscopy analysis. Through this guide, users can master comprehensive skills from basic operations to advanced functions. It is recommended to practice with actual data and regularly update the software to access new features. In the future, with AI integration, this software will further optimize automated analysis and drive scientific research innovation.

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JEOL JSM-T200 Series Scanning Electron Microscope: Comprehensive User Guide and Technical Analysis

Chapter 1: Equipment Overview and Technical Specifications

1.1 Product Design Philosophy and Technical Positioning

The JEOL JSM-T200 series scanning electron microscope combines simplified operation, easy maintenance, and high performance, enabling even users without professional operational skills to easily obtain high-quality microscopic images. Its advantages, such as a large depth of field, a wide magnification range, and minimized sample preparation requirements, make it an effective instrument in research, quality control, and visual education fields.

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1.2 Detailed Explanation of Core Technical Parameters

Electron Optical System Performance Indicators:

  • Resolution: Under conditions of 25 kV accelerating voltage and a 20 mm working distance, the resolution can reach 10 nm (100 angstroms).
  • Magnification: Continuously adjustable from 15x to 100,000x (15x is only available at a 48 mm working distance).
  • Accelerating Voltage: Five options are provided: 2, 5, 10, 15, and 25 kV.
  • Electron Gun Filament: Utilizes a pre-aligned box-type tungsten filament.
  • Lens System: A three-stage condenser system (two condenser lenses and an objective lens).
  • Alignment System: Mechanical alignment.
  • Stigmator: Octupole electromagnetic stigmator.
  • Image Shift: ±10 μm electromagnetic shift in any direction, controlled by a joystick.

Sample Stage Technical Parameters:
Centered Sample Stage (Type I):

  • Sample Size Capacity: Maximum diameter of 10 mm × thickness of 10 mm.
  • Movement Range: 10 mm on the X-axis and 20 mm on the Y-axis.
  • Tilt Angle: Continuously adjustable from -40° to +90°.
  • Rotation Angle: 360° full rotation.
  • Working Distance: 20 mm.
  • Sample Exchange Method: Achieved by pulling out the sample stage.

1.3 Scanning Detection System Configuration

Secondary and Backscattered Electron Detection: An integrated detector comprising a scintillator, light guide, photomultiplier tube, and collector is used.
Optional Detectors:

  • Backscattered Electron Detector: Enables the acquisition of both morphological and compositional images.
  • Transmission Electron Detector.
  • Cathodoluminescence Detector.
  • Sample Current Detector.
  • X-ray Detector.

Chapter 2: Equipment Installation and Environmental Requirements

2.1 Power and Water Supply Configuration Requirements

Power Supply:

  • Voltage: 100 V, 50/60 Hz, single-phase.
  • Power: Basic instrument: 1.2 kVA, accessories: 0.8 kVA, totaling 2 kVA.
  • Starting Current: 60 A (0.2 seconds).
  • Voltage Fluctuation: No more than ±10%.
  • Grounding Requirement: One terminal with a resistance of less than 100 Ω.

Cooling Water System:

  • Flow Rate: 2 liters per minute (pressure range: 0.05-0.2 MPa).
  • Water Temperature: 20 ± 5°C (outlet water temperature not exceeding 35°C).

2.2 Installation Environment Technical Specifications

Indoor Environmental Requirements:

  • Room Temperature: 20 ± 5°C.
  • Relative Humidity: Less than 80%.
    Ground Vibration:
  • At 5 Hz: Less than 2 μm peak-to-peak in the X, Y, and Z directions.
  • At 10 Hz: Less than 3 μm peak-to-peak in the X, Y, and Z directions.
  • At 50 Hz: Less than 8 μm peak-to-peak in the X, Y, and Z directions.
    Stray Magnetic Field: Less than 0.3 μT (3 milligauss).

Chapter 3: Comprehensive Analysis of Equipment Operation Procedures

3.1 Standard Startup and Shutdown Procedures

Startup Operation Procedure:

  • Turn on the faucet to supply cooling water to the microscope (water flow rate: 1.5-2 liters per minute).
  • Turn on the main power switch on the distribution board and press the power switch on the left panel of the control console.
  • Wait for 15-30 minutes until the magnification panel displays a reading, indicating that the column vacuum has reached a sufficient level to generate an electron beam and observe samples.

Shutdown Operation Procedure:

  • Press the power-off switch.
  • Turn off the main power switch.
  • Wait for 10-15 minutes to allow the diffusion pump to cool to room temperature.
  • Turn off the faucet.

Special Situation Handling:

  • Power Failure: The microscope stops automatically. Manual reactivation is required after power restoration.
  • Water Supply Failure: The microscope stops automatically. Manual reactivation is required after water supply restoration.

3.2 Technical Specifications for Sample Installation

Centered Sample Stage Installation Steps:

  • Press the exhaust switch to allow air into the column.
  • Wait approximately 40 seconds for the column to be fully exposed to the atmosphere.
  • Insert the sample stub with the sample into the sample holder.
  • Adjust the sample height adjustment screw so that the sample surface is flush with the edge of the holder.
  • Secure the sample stub using the sample stub fixing screw.
  • Return the sample stage to the sample chamber.
  • Press the vacuum evacuation switch.

3.3 Detailed Explanation of Image Observation Techniques

Secondary Electron Image (SEI) Observation Setup:

  • Set the sample stage control parameters and working distance selector.
  • Set the detector panel and control panel control parameters.
  • Press the accelerating voltage on button.
  • Press the line scan and exposure buttons in sequence.
  • Adjust the filament control knob to approximately the 11 o’clock position.
  • Gradually rotate the filament control knob to approximately the 2 o’clock position.
  • Observe the waveform changes on the CRT screen.
  • Press the image mode button to observe the rapid exposure marker and raster.

Backscattered Electron Image (BEI) Observation:
The operation steps are the same as those for SEI observation, but press the BEI button during the initial setup and control the spot size between 12 and 3 o’clock.

3.4 Guide to Using Automatic Functions

Automatic Focusing Mode Operation Procedure:

  • Use the coarse focusing control to roughly focus the image.
  • Use the fine focusing control to precisely focus the image.
  • Press the auto button, and the focus light on the display panel illuminates.
  • When the magnification and/or field of view changes, press the auto button on the right side of the focusing panel.

Fully Automatic SEM Image Acquisition:
Images will automatically appear when the power switch is pressed under the following control settings.

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Chapter 4: Technical Analysis of Photographic Recording System

4.1 Photographic Recording System Configuration

Comparative Analysis of Four Photographic Recording Systems:

  • CSI-1: Standard configuration, Brownie film, 1:0.5 photographic ratio.
  • CSI-2: Polaroid film pack, 1:0.75 photographic ratio (optional).
  • CSI-3: 35 mm film, 1:0.25 photographic ratio (optional).
  • CSI-4: Polaroid loose-leaf film, 1:1 photographic ratio (optional).

4.2 Technical Specifications for Photographic Operation

Scanned Image Photography Procedure:

  • Install the recording system on the CRT and secure it with hinge pins.
  • Insert the CSI connector into the socket on the display panel.
  • Obtain an image on the CRT.
  • Swing the CSI onto the CRT and secure it with a latch bar.

4.3 Film Selection and Parameter Settings

Relationship Between Film Sensitivity and f-value:

  • 50 ASA → 5.6-8 f.
  • 75, 100 ASA → 8-11 f.
  • 200 ASA → 11-16 f.
  • 400 ASA → 16-22 f.

Notes on the Use of Ultra-High-Speed Film:
Ultra-high-speed film (ASA 3000) is generally not suitable for image recording due to its lower resolution and narrower latitude. The use of such film should be limited to special-purpose photography, such as recording dynamic behavior.

Chapter 5: Equipment Maintenance and Troubleshooting

5.1 Key Points of Daily Maintenance

Oil Rotary Pump Maintenance:

  • Regularly check the oil level and replenish as needed.

Diffusion Pump Heater Replacement:

  • Turn off the power switch and the main power switch on the distribution board.
  • Remove the rear panel.
  • Allow the heater assembly to cool.
  • Remove the heater assembly.
  • Take out the heater from the cover.
  • Disconnect the leads connected to the heater and remove the heater.

5.2 Technical Guidance for Component Replacement

Electron Gun Filament Replacement Steps:

  • Press the exhaust switch to allow air into the column.
  • Loosen the alignment screws and remove the electron gun from the column.

Chapter 6: Advanced Applications and Optimization Techniques

6.1 Advanced Imaging Techniques

Methods for Optimizing Image Contrast:

  • High-Contrast Image: Rotate the contrast control knob clockwise until the exposure marker bar exceeds the standard white level bar.
  • Low-Contrast Image: Rotate the contrast control knob counterclockwise.
  • Automatic Brightness and Contrast Control: First obtain the optimal image brightness and contrast at approximately 1000x magnification, then press the auto control button on the control panel.

6.2 Performance Optimization Strategies

Key Points of Stigmator Correction Techniques:

  • Press the image shift button.
  • Set the stigmator control knob to the 12 o’clock position.
  • Observe the direction of image blur and adjust the stigmator control knob accordingly.

Adjustment of Rapid Exposure Marker:
This marker has been optimized for exposure using ASA 75 film with the lens aperture set to fully open before factory shipment. Therefore, under normal circumstances, as long as the film speed and lens aperture are maintained at ASA 75 and fully open, respectively, no adjustment of the rapid exposure marker is required. However, since the optimal exposure may vary depending on the condition and nature of the sample, occasional adjustments may be necessary. In addition, adjustments will be required when taking high-contrast and low-contrast micrographs.

This user guide covers all operational procedures of the JEOL JSM-T200 series scanning electron microscope, from basic operations to advanced applications, and from routine observations to precision photography. It provides users with a complete and detailed set of operational technical guidance. By following the operational norms outlined in this guide, users can fully leverage the equipment’s performance and obtain high-quality experimental results. At the same time, regular maintenance will ensure the long-term stable operation of the equipment and extend its service life.